HCSS to Award 17 Scholarships to Construction Industry Interns

HCSS will be awarding a total of $50,000 in college scholarships to students in construction-related fields; deadline is September 16, 2016

2015 Construction Intern Award winner, Chase Ekstam, interned at APAC-Central, Inc., while he was a student at Missouri State University.
2015 Construction Intern Award winner, Chase Ekstam, interned at APAC-Central, Inc., while he was a student at Missouri State University.

Submissions are now open for the 2016 Construction Intern Awards. Construction software developer HCSS will be awarding a total of $50,000 in college scholarships to students in construction-related fields. The top winner will receive a $10,000 scholarship. In addition, four finalists will each receive a $4,000 scholarship and 12 honorable mentions will be awarded a $2,000 scholarship.

Eligible internships include any internship in a construction-related field of at least two months in length that occurred during the 2015-2016 school year or Summer 2016. Participants must have been enrolled in a college, university or trade school for the 2015-2016 school year. Submissions will be accepted until September 16.

To enter, students simply need to visit www.constructioninternawards.com to register and fill out a brief questionnaire with a summary of their experience. Two groups of finalists will be among the top 17 entries — eight entries chosen from popular vote and nine entries chosen by a selection committee. Those 17 combined finalists are guaranteed at least a $2,000 scholarship, and will be submitted to a voting panel comprised of seasoned industry experts, representing varied sectors of the construction industry. That panel will choose the top students; four will be named finalists who will each receive a $4,000 scholarship and one Intern of the Year will be awarded the Grand Prize $10,000 scholarship.

In addition to scholarship awards, HCSS will give away several smaller prizes throughout the contest though participation in social media.   

The panel includes:

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